CSR article – Reducing wafer test time

Reducing wafer test time Our CEO Klemens Reitinger has contributed to the Jan/Feb issue of Chip Scale Review magazine with an article discussing the importance of reducing wafer test time. “This article will explain why it is so important to generate new solutions that reduce the expensive waiting time in ...

ERS introduces cutting-edge innovation in semiconductor thermal testing

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness. The new AirCool PRIME family of thermal chucks, developed in ...

ERS electronic will showcase manufacturing innovation at Semicon Europa

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world’s leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous ...

ERS appoints seasoned expert to fill new CSMO position

Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer, (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing. Laurent Giai-Miniet brings more than 25 years of experience in the semiconductor, global electronics and internet of Things spaces. Laurent has held ...

New generation of Debonders and Warpage Adjusters boosts productivity

The ERS ADM330 is designed for the thermal debonding of eWLB style wafers without human intervention at high precision and with unmatched repeatability, resulting in high and predictable process quality and thus guaranteeing high yield. The two handling robots accept wafers with a maximum warpage of +/- 5 mm; after ...
简体中文