Category: News (Page 1 of 6)

ERS Electronic GmbH is announcing ONC as its newest Distribution Partner for Japan

ERS Electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is announcing the addition of the Japanese semiconductor equipment vendor ONC as their new distribution partner. As of December, ONC will be selling ERS’ Thermal Chuck systems to their customers across Japan, from their headquarters ...

ERS Electronic is adding the French semiconductor equipment supplier Microworld as their new Channel Partner

ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce Microworld as their new distributor for France, Switzerland and North Africa. As of October, Microworld has been selling and servicing ERS’ cutting-edge Thermal Chucks to their clients, from their headquarters in ...

ERS’ Thermal Chucks Will Be Available In SEMICS’ Renowned OPUS3 Product Line of Manufacturing Probers

ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is pleased to announce a new engagement with the Korean semiconductor equipment supplier, SEMICS Inc. As of today, ERS’ cutting-edge thermal chucks will be available as an option in SEMICS’ OPUS3 probers. The OPUS3 line ...

ERS electronic introduces Bernd Krafthoefer as The Americas Sales and Marketing Director.

Mr. Krafthoefer will be based in Dallas, Texas. As ERS Americas’ Sales and Marketing Director, Mr. Krafthoefer will oversee ERS electronic America’s customer accounts. Mr. Krafthoefer has held worldwide sales and marketing positions with Texas Instruments, Diodes Inc., ams AG and Active-Semi (now Qorvo). For 20 years, Mr. Krafthoefer successfully ...

ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor ...