Kategorie: News (Seite 1 von 2)

ERS now offers its technology for Fan-out Debonding and Warpage Adjustment in a fully-automatic machine for panels up to 650 x 650 mm

ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018, ...

convERSations: Ronny Wagner

Shortly after joining our company in 2007, Ronny was asked to help us develop the first-ever Thermal Debonding station. Over the past almost 15 years he has worked on every Fan-out machine that ERS has developed and has travelled all over the world to install and service the machines at ...

convERSations: Klemens Reitinger

Klemens Reitinger is the CTO and CEO of ERS electronic. In the almost 30 years that he has been working at ERS, he has been the brain behind several of the technologies that ERS is famous for today, including AirCool® and its successors. As temperature’s role in wafer probing is ...

convERSations: Bernd Krafthöfer

Bernd Krafthöfer is the Sales and Marketing Director of ERS Americas LLC and is based in Dallas, Texas. In the midst of his preparation for SW Test San Diego, which is the first in-person conference he is attending after a long period of strictly virtual events, we talked to him ...

convERSations: Debbie-Claire Sanchez

Debbie joined ERS in 2018, has worked for more than seven years in the field of wafer-level packaging, both Fan-in, and Fan-out, and is driving the development of ERS’ Thermal Debonding and Warpage Adjustment equipment for Fan-out applications. We talked to her last week and asked her about her reasons ...