Kategorie: Featured (Seite 1 von 3)

ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330

NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction. Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies. However, wafer deformity, also called “warpage” ...

convERSations: Bengt Haunerland

Q: You are our Head of Software and Electronics, and have been working on the development of our latest innovation, ProbeSense™, for the past two years. Where did this idea come from, and what were some of the biggest challenges in the development process? Bengt: The project basically started with ...

ERS electronic introduces ProbeSense™, a state-of-the-art measurement device for automated temperature calibration in wafer test

MAY 24th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration device that allows automatic and highly accurate measurements below 30mK in the actual probing area. The patent-pending device, aptly named ProbeSense™, consists of a temperature sensor, ...

ERS electronic announces the AC3 Fusion thermal chuck system, a versatile and more sustainable solution for temperature test in wafer probing

APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system comes with a new series of high-performance chillers that have three default on-site configurable modes, each ...

ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features

March 30th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and ...