With the increasing demand for high-performance computing, AI, and energy-efficient electronics, Advanced Packaging has become a key enabler of innovation. Recognizing its strategic importance, Europe is ramping up efforts to strengthen its position in this field—through investments, collaborations, and new initiatives aimed at boosting local capabilities. Last week, ERS celebrated ...
ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on info@ers-gmbh.de. Event Calendar 2024: Semicon Korea January 31st – February 2nd, COEX, Seoul, Korea Co-exhibiting with Korean channel ...
ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on meetus@ers-gmbh.de. Event Calendar 2022: Semicon Korea February 9th – 11th, Korea World Trade Tower, Seoul, Korea Co-exhibiting ...
ERS electronic will be attending and presenting at this year’s Hybrid SW Test from August 30th to September 1st. The physical event location is San Diego, California, but it will also be possible to attend the event online. Our CTO Klemens Reitinger will be presenting on the topic of „High ...
ERS electronic will be attending and presenting at this year’s SYNAPS (Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors), which takes place online from May 18th to 20th. Our Fan-out Equipment Business Unit manager Debbie-Claire Sanchez will present our latest research on Fan-out Wafer Level Packaging, titled ...
