With the increasing demand for high-performance computing, AI, and energy-efficient electronics, Advanced Packaging has become a key enabler of innovation. Recognizing its strategic importance, Europe is ramping up efforts to strengthen its position in this field—through investments, collaborations, and new initiatives aimed at boosting local capabilities.
Last week, ERS celebrated the opening of its new Production, R&D Facility and integrated Competence Center for Advanced Packaging in Barbing, Germany. In this webinar, Debbie-Claire Sanchez, Head of Advanced Packaging Equipment Business Unit at ERS electronic, will present the capabilities of and vision for this facility as a test and demo center, as well as collaboration hub for joint innovation. Additionally, ERS has invited three industry experts to share their insights on the latest developments, challenges, and opportunities shaping the European Advanced Packaging landscape:
Dr. Tanja Braun, Fraunhofer IZM – „Current Trends in Fan-out Wafer and Panel Level Packaging“
Sylvie Joly, CEA-Leti – “Shaping the future of electronics: CEA contribution to 3D integration and 2.5D advanced packaging”
Steffen Kröhnert, ESPAT Consulting – „Electronics Packaging in Europe – Growing or Vanishing?“
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