Automatic Warpage Adjust Tool

The WAT is a fully automated warpage correction tool, providing optimal results with ERS’ TriTemp Slide technology

wat330 web


The ERS WAT is a fully automatic tool for the thermal forming of 200 mm (WAT200) or 300/330 mm (WAT300/330) FOWLP wafers.  The specially-designed ERS TriTemp Slide in this system makes it possible to successfully form a wide variety of FOWLP wafers at various stages in their processing and the resulting wafer shape can be matched to the handling specifications of the downstream tool.

The ERS WAT is able to process up to four FOUPs in a fully-automatic operation.  It is equipped with a Wafer-ID reader and an automatic warpage measurement station that enables a high flexibility with 3 separate operation modes.

The upgraded WAT330 comes with a HEPA filter system for cleanroom class 100. It is also fully compliant with the GEM300 SEMI standards and compatible with automated product loading and unloading. Another upgrade is the machine’s Nitrogen environment, which can reach down to 0.5% O2 level to avoid Cu oxidation. The new WAT330 also features strong vacuum thermal chucks for no-fail wafer handling.


Technical data

Wafer Size
200 mm or 300/330 mm
Handling System
One 4-Axis Robot; special endeffector
Maximum Input Warpage
+/- 7mm
Warpage Adjust Method
ERS TriTemp Slide
Typical Output warpage
< 500µm
Temperature Control
DC PID and ERS AirCool® components
Temperature Range
-10°C up to +260°C (depending on station)
Oxygen Free Environment


W x D x H
2273 x 1134 x 1741 mm

Facility Supply

400 VAC 3-phase 32A
50 / 60 Hz
18 kW
CDA Pressure
6 bar at 0 °C dew point
CDA Flow Rate
1000 l/min peak
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min

For special requirements, please contact us.