ERS’s Automatic Luminex Machines, LUM300A1 and LUM300A2, are setting new standards for innovation and efficiency in semiconductor debonding. Featuring state-of-the-art capabilities, these machines are designed to meet the rigorous demands of high-volume manufacturing while ensuring superior performance and reliability.

With the robust handling capabilities, the machines effortlessly manage wafers as thin as 100 microns, maintaining integrity and precision throughout the debonding process. With SECS-II/GEM host communication, these machines seamlessly integrate into your production line, with an upgrade option to GEM300 for enhanced automation and control. This ensures compatibility with modern semiconductor manufacturing standards and facilitates efficient data exchange and process monitoring.

The user-friendly, interactive interface simplifies operation, allowing the users to efficiently manage and monitor the debonding process. The system’s high yielding, high throughput capability, processing up to 50 wafers per hour, significantly boosts productivity and operational efficiency, making it an indispensable asset for high-volume manufacturing environments.

Thanks to ERS’s PhotoThermal Debonding Technology, these automatic machines are compatible with a wide range of bonding materials. This adaptability caters to the high product variability often encountered in Outsourced Semiconductor Assembly and Test (OSAT) facilities, ensuring that the machines can meet diverse production needs without compromising on performance or quality.