ERS electronic adds PRIME 200 to their AirCool® thermal chuck family

ERS electronic GmbH, the industry-leading manufacturer of thermal management solutions for the semiconductor market will offer its customer-favourite AirCool® PRIME for 200 mm wafer format. Following the success of the 300 mm version, the innovation leader has added a 200 mm counterpart, promising the same performance in a smaller form ...

ERS at SEMICON China 2020

Meet us at SEMICON China 2020 (27th – 29th June) Once again, ERS will be attending SEMICON China in the Shanghai New International Expo Centre. Find us in Hall E3, booth #3109 – we cannot wait to see you all there! Follow our LinkedIn page for more information.

ERS 50 Year Anniversary article in Markt&Technik 15/2020

ERS was featured in the 15/2020 issue of Markt&Technik. Click the link below to read about our 50 year long history of groundbreaking inventions, as told by our CEOs Klemens Reitinger and Laurent Giai-Miniet. ERS 50. Geburtstag

ERS Thermal Chuck article in Markt&Technik Daily Magazine – SEMICON Europa 2019

ERS Thermal Chuck article During SEMICON Europa 2019, ERS was featured in the daily Markt&Technik magazine, with an article all about our Thermal Chucks. Click the link above to read this deeply insightful article about the technical competencies of our Chuck systems, and how they are implemented in Wafer testing! ...

ERS at SEMICON Korea 2020

Meet us at SEMICON Korea 2020 (5th – 7th February) We are proud to announce that we shall be exhibiting at SEMICON Korea 2020 (5th – 7th February) at COEX, Seoul, Korea. Find us in Hall A, booth #410, we cannot wait to see you all there! Follow our LinkedIn page ...