Automatic Luminex

Experience the future of semiconductor debonding with ERS’s fully automatic Luminex machines, setting a new standard for efficiency, flexibility, and throughput in high-volume manufacturing environments. Engineered with precision and innovation, these state-of-the-art machines empower semiconductor manufacturers to achieve unparalleled levels of productivity and performance.

Product Description

ERS’s Automatic Luminex Machines, LUM300A1 and LUM300A2, are setting new standards for innovation and efficiency in semiconductor debonding. Featuring state-of-the-art capabilities, these machines are designed to meet the rigorous demands of high-volume manufacturing while ensuring superior performance and reliability.

With the robust handling capabilities, the machines effortlessly manage wafers as thin as 100 microns, maintaining integrity and precision throughout the debonding process. With SECS-II/GEM host communication, these machines seamlessly integrate into your production line, with an upgrade option to GEM300 for enhanced automation and control. This ensures compatibility with modern semiconductor manufacturing standards and facilitates efficient data exchange and process monitoring.

The user-friendly, interactive interface simplifies operation, allowing the users to efficiently manage and monitor the debonding process. The system’s high yielding, high throughput capability, processing up to 50 wafers per hour, significantly boosts productivity and operational efficiency, making it an indispensable asset for high-volume manufacturing environments.

Thanks to ERS’s PhotoThermal Debonding Technology, these automatic machines are compatible with a wide range of bonding materials. This adaptability caters to the high product variability often encountered in Outsourced Semiconductor Assembly and Test (OSAT) facilities, ensuring that the machines can meet diverse production needs without compromising on performance or quality.

 

Specifications

Input Product

Wafer Size
300 mm
Wafer/Panel Thickness
100um to 900um*
Carrier Type
Glass with Light Absorbing Layer (LAL)
Carrier Thickness
<2mm

Key Components (LUM300A1 and LUM300A2)

Loadports/Input Station
2x FOUP loader for LUM300A1 and 3x FOUP loader for LUM300A2, E84 Compliant
4x RF ID Reader (Option)
Wafer Handler
1x
Flip Function
1x
Pre-alignment and Notch Detection
x, y, z and θ alignment
Pre-aligner Accuracy
Centering <0.1mm
Glass Carrier ID Reader
OCR, Barcode, 2D Matrix
Host Communication
SECS-II/GEM, GEM300
Throughput
LUM300A1: 50 Wafers per Hour
LUM300A2: 45** Wafers per Hour

Debond Module (LUM300A1 and LUM300A2)

Debond Method
PhotoThermal via Flash Lamp
Wavelength
200 - 1100 nm
Laser Transmittance
0%
Stage Motion Accuracy | Thermal Control
~10um position accuracy
Active Cooling on Chuck
Force Sensor
1x Debond Force Monitoring

Wafer Cleaning Module (only LUM300A2)

Wafer Spinner Chamber
4x Multiple Nozzle and Pattern Options
Rotation Speed (RPM)
20 – 8000, ±1 rpm

Dimensions

W x D x H
LUM300A1: 2500 x 1800 x 2200 mm
LUM300A2: 3200 x 1800 x 2200 mm
Lamp control unit: 1200 x 900 x 1800 mm
Weight
LUM300A1: 1200 kg
LUM300A2: 1500 kg
700 kg (Lamp control unit)

Facility Supply

Voltage
400 VAC 3-phase 32A
Frequency
50 Hz
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min

* Thickness not included in the range needs further evaluation
** Depending on cleaning recipe
For special requirements, please contact us.