Manual Panel Debond Machine

The MPDM is a manual debonding station, specifically designed for research and development laboratories or pilot lines during the ramp up of new technologies.

Description

The ERS MPDM System is ideal for the separation of the panel from its carrier related to the FOPLP technology. The debonding of the thermal release bonding agents is performed. The system offers high repeatability of results with respect to the quality of the debonded wafer.

Its special vacuum design and the large range of operating temperatures (up to +240°C) allow the debonding of very thin panels and warpage correction of up to 10mm. Like the previous generation of ERS tools, the MPDM features a contactless and smooth transport mechanism, which enables the transport of the panels from one temperature zone to the other while repairing warpage.

This tool is specially designed for research and development laboratories or pilot lines during the ramp-up of new technology.

Features

FOPLP optimized thermal debonding
FOPLP wafer warpage control
Warpage adjust only mode
MMI with touch screen

MPDM

Technical data

Machine Description

Manual thermal debonding machine with warpage adjustment function

Product size

200mm, 300mm wafer Ø and panels up to 615mm x 615mm

Product thickness

300µm to 1000µm

Carrier size

Up to 630mm x 630mm

Carrier thickness

0,5 to 5,0mm

Warpage Handling Capability

Input: ±10mm, Output: <1mm

Throughput (WPH)

*>15 wafers per hour

Temperature Range

-10°C to 260°C (Station Dependent)

Temperature Uniformity

Set Point ± 3°C

Wafer Transfer System

TriTemp Slide and AirCushion System

ESD Control

Strategic ionizer location with Auto-feedback system

For special requirements, please contact us.

Please be advised that the data in this table may vary depending on other factors.