Automatic Debond System

Fully automatic FOWLP wafer debond system

Advanced thermal debonding solutions based on ERS’s TriTemp Slide technology.

adm330 gen3 web v1


ADM330 Gen 3 Upgrade:

ADM330 Gen 3 is the latest and most advanced version of ERS’s automatic thermal debond machine for Fan-out Wafer Level Packaging. It comes with a sleek, white surface that perfectly matches a cleanroom. Key feature improvements are:

  • Unique thermal chuck design allowing strong vacuum capability
  • GEM300 compliance for Industry 4.0

Optional add-ons:

  • Enhanced traceability with double-sided wafer ID marking option
  • Software add-on for standalone wafer ID laser marking sequence

In-situ feature: Warpage Adjustment Tool

The ERS ADM System is designed for fully automated separation of wafer and carrier related to the FOWLP technology („debonding“). Automated debonding for thermal release bonding agents is performed. After that, a proprietary thermal process is applied to reduce and control warpage of the debonded, reconstituted wafer. The system provides high throughput and repeatability of results with respect to the quality of the debonded wafer. The integrated laser scribing chamber in the ADM makes 100% monitoring of production-relevant data downstream of the debonding process possible.

It is equipped for continuous operation with optional FOUP unloading for 200 (ADM200), 300mm or 330mm (ADM330) FOWLP wafers. The system is equipped with OCR/BCR capabilities and ready for SECS/GEM interface integration. The system reads the ID on the carrier and can pass this ID number on to the factory server via the SECS/GEM interface. A recipe download from the server is then possible as is the uploading of result data to the server. Uploading of data from the automatic debonding, automatic de-taping, automatic wafer scribing (and ID-read checking) as well as data from the highly accurate warpage inspection station is possible. Immediate carrier reuse is possible.


  • FOWLP optimized thermal debonding
  • Fully automatic detaping
  • FOWLP wafer warpage control and inspection
  • FOWLP wafer frontside marking
  • Fully automatic “warpage adjust only” mode
  • MMI according to SEMI E95
  • SECS/GEM according to SEMI E005 and E030



Wafer size
200 mm (ADM200) or 300/330 mm (ADM330)
Handling system
One 3 and one 4-Axis Robot; special endeffector
Debond System
Thermal, force controlled
Detape System
Vacuum and mechanical
Detape Angle
Adjustable within 45°
Maximum Input Warpage
+/- 5mm
Warpage Adjust Method
ERS TriTemp Slide
Typical Output warpage
< 500µm
Up to 25 depending on product
Temperature control
DC PID and ERS AirCool® components
Temperature range
Room temperature to +240°C (depending on station)
Debond Force
Laser marking
Diode-pumped system, 1064 nm
Oxygen Free Environment


W x D x H
3126mm x 1856mm x 2105mm

For special requirements, please contact us.