Semi-Automatic Luminex

Unlock the efficiency and flexiblity of PhotoThermal debonding with ERS’s Luminex product line. The semi-automatic LUM600S1 is engineered to streamline the debonding process with ease of use and cost-effectiveness in mind. It offers a perfect balance of automation and manual control, making it a great springboard for research and development teams who are working on Advanced Packaging developments or New Product Introduction.

Product Description

Introducing LUM600S1, ERS’s Semi-Automatic Luminex Machine, a versatile and efficient solution for semiconductor debonding, tailored to meet the needs of both engineering development and low to mid-volume production. This innovative machine is designed to handle multiple wafers or panels, maintaining precision and robustness even with substrates as thin as 100 microns, ensuring consistent and reliable performance across various applications.

The machine features an intuitive user interface, making it easy for operators to navigate and control. Its manual handling with mechanical alignment, leveraging Poka yoke design principles, provides operators with the confidence and precision needed for optimal performance.

Flexibility is at the core of the LUM600S1, making it adaptable for any engineering or product development needs. Whether you’re exploring new materials, processes, or product designs, this machine offers the versatility to accommodate evolving requirements, empowering innovation and experimentation without compromising efficiency.

Perfectly suited for low to mid-volume production or New Product Introduction (NPI), the Semi-Automatic Machine offers the scalability to grow with your manufacturing needs. Its robust capabilities and reliable performance make it an invaluable asset for developing and producing next-generation semiconductor products.


Input Product

Wafer Size
200 mm, 300 mm wafer and Panel up to 600 x 600 mm
Wafer/Panel Thickness
100um to 900um*
Carrier Type
Glass with Light Absorbing Layer (LAL)
Carrier Thickness

Key Components

Substrate placement and pre-alignment
Manual Loading with mechanical alignment (POKA YOKE design)
Parameter control
Recipe controls on X, Y shot positioning
Offline light intensity check
Host communication
>50 WPH
Working environment
Temp: 20-25°C; Humidity: 50%-70%
Operation access
3-level hierarchy


W x D x H
1500 x 1950 x 2010 mm
Lamp Control Unit: 1200 x 900 x 1800 mm
560 kg
Lamp Control Unit: 700 kg

Facility Supply

400 VAC 3-phase 32A
50 Hz
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min

*Thickness not included in the range needs further evaluation
For special requirements, please contact us.