ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16). ERS is resuming its presence at Semicon China after 12 years with the ...
“In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented”, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its ...
eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with ...
ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is extending its partnership with Taiwan-based Chain Logic International Corp. (CLIC) to the market of mainland China. With this move, the proven and fruitful collaboration with CLIC on the Taiwanese market finds its logical ...
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until September 2018. ISO, the International Organization for Standardization (www.iso.org), is the world’s largest developer and publisher of International Standards established by a membership ...