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ERS Competence Center celebrates fifth anniversary
“In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented”, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its ...ERS ready for imminent eWLB upswing
eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with ...ERS extends CLIC Partnership to Mainland China
ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is extending its partnership with Taiwan-based Chain Logic International Corp. (CLIC) to the market of mainland China. With this move, the proven and fruitful collaboration with CLIC on the Taiwanese market finds its logical ...
ERS awarded ISO 9001:2008 Recertification
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until September 2018. ISO, the International Organization for Standardization (www.iso.org), is the world’s largest developer and publisher of International Standards established by a membership ...