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convERSations: Laurent Giai-Miniet
Laurent first joined ERS in 2016 as a consultant in what was supposed to be a short-term engagement. However, he ended up joining the company as CSMO in 2017, and a year later he became co-CEO of the company. It’s been almost five years since he made the decision to ...
ERS now offers its technology for Fan-out Debonding and Warpage Adjustment in a fully-automatic machine for panels up to 650 x 650 mm
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018, ...
convERSations: Ronny Wagner
Shortly after joining our company in 2007, Ronny was asked to help us develop the first-ever Thermal Debonding station. Over the past almost 15 years he has worked on every Fan-out machine that ERS has developed and has travelled all over the world to install and service the machines at ...
convERSations: Joshua Zhou
Joshua opened our office in Shanghai in 2018 and was promoted to Vice President of ERS earlier this year. In only a little more than three years, he has built a solid team and significantly increased the presence of ERS in the China region. Today he is presenting our thermal ...