ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor ...

ERS at SEMICON Korea

Meet us in Seoul! January 23 – January 24, 2018 Korea World Trade Tower, Booth-A504, Hall-A.

ERS electronic is adding Spirox Technology Co., Ltd. as a new sales channel partner in China.

ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces the addition of Spirox Technology Co., Ltd. as a new sales channel partner. Spirox will help ERS electronic GmbH to deliver highly-differentiated thermal solutions to the fast-growing number of semiconductor companies in China. ...

ERS at SEMICON Japan

Meet us in Tokyo! December 12 – December 14, 2018 Tokyo Big Sight, Booth-2225

Announcing a new flavor in ERS AC3 Thermal Chucks, the High-Thermal Uniformity (HTU) product line.

ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces a major innovation in its revolutionary AC3 AirCool® only product line; the High Thermal Uniformity (HTU) line brings a new range of wafer temperature probing capabilities to the semiconductor industry. With the new ...