ERS electronic GmbH at NCAP

Meet us in NCAP Shanghai! April 22 – April 23, 2019 ERS electronic is excited to participate in the 2019 Yole Développement and NCAP Advanced Packaging & System Integration Technology Symposium, which is taking place at the Grand Mercure Shanghai Century Park Hotel, from April 22 – 23. ERS’ Debbie ...

ERS electronic GmbH at SEMICON China

Meet us in Shanghai! March 20 – March 22, 2019 Shanghai New International Expo Centre, Hall-4, Booth-4386

ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor ...

ERS at SEMICON Korea

Meet us in Seoul! January 23 – January 24, 2018 Korea World Trade Tower, Booth-A504, Hall-A.

ERS electronic is adding Spirox Technology Co., Ltd. as a new sales channel partner in China.

ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces the addition of Spirox Technology Co., Ltd. as a new sales channel partner. Spirox will help ERS electronic GmbH to deliver highly-differentiated thermal solutions to the fast-growing number of semiconductor companies in China. ...