Announcing a new flavor in ERS AC3 Thermal Chucks, the High-Thermal Uniformity (HTU) product line.

ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces a major innovation in its revolutionary AC3 AirCool® only product line; the High Thermal Uniformity (HTU) line brings a new range of wafer temperature probing capabilities to the semiconductor industry. With the new ...

ERS Welcomes Debbie Claire Sanchez as Fan-Out Wafer Level Packaging (FOWLP) Equipment Strategic Product Manager

ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, is proud to announce that effective immediately Debbie Claire Sanchez is becoming the Strategic Product Manager for its FOWLP product line in Germering, Germany. In hiring Debbie Claire Sanchez, ERS is gaining a distinguished ...

ERS and MPI’s AirCool® PRIME Thermal Chucks recognized at the Electronics Industry Awards 2018

Tuesday evening, during the Electronics Industry Awards ceremony held in Birmingham (UK), ERS and MPI’s joint product AirCool® PRIME Chuck won an award in the category, “Test, Measurement and Inspection Product of the year”. The awards show was organised by Datateam Business Media in association with CIE Magazine, Electronics magazine ...

ERS at SW Test Asia

Meet us in Hsinchu! October 18 – October 19, 2018 Sheraton Hsinchu Hotel

ERS at Semicon Taiwan in Taipei

Meet us in Taipei! September 5 – September 7, 2018 Taipei Nangang Exhibition Center
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