ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this year from the German high-tech company will make the native advantages of this technology available to applications beyond ...
One and a half years after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors. The ERS lab provides the opportunity to utilize ERS’ latest tools ...
ERS presented its new wafer thermal test system – the ERS AirCool®3 – during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products – AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool®products, the AirCool®3 exclusively uses air for cooling and ...