ERS displayed sub-zero module of its new AirCool®3 System in Tokyo

ERS presented its new wafer thermal test system – the ERS AirCool®3 – during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products – AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool®products, the AirCool®3 exclusively uses air for cooling and is designed to be quickly and easily upgradeable on site. Adaptations for the AirCool®3 are available for all major wafer prober models.

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