June 29th, 2023 – ERS electronic GmbH, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce the establishment of ERS China lab in Shanghai, in collaboration with Shanghai Jinni Electronic Technology Co., Ltd (Jinni). As a trusted technical third party, Jinni has ...
ERS electronic GmbH, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is pleased to announce the addition of a new investor, Gimv, a Belgian private equity firm listed on the Euronext 100. Gimv has a long track record of strategic investments in highly innovative, financially ...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions that provides a comprehensive and ...
PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a fully-automated photonic debonding solution to the semiconductor industry. This collaboration brings together the industry leader in thermal management solutions for semiconductor manufacturing, ERS electronic, and an industry innovator in applied thermal energy, PulseForge, Inc. ERS electronic ...
NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction. Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies. However, wafer deformity, also called “warpage” ...
