NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction. Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies. However, wafer deformity, also called “warpage” ...
Q: You are our Head of Software and Electronics, and have been working on the development of our latest innovation, ProbeSense™, for the past two years. Where did this idea come from, and what were some of the biggest challenges in the development process? Bengt: The project basically started with ...
MAY 24th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration device that allows automatic and highly accurate measurements below 30mK in the actual probing area. The patent-pending device, aptly named ProbeSense™, consists of a temperature sensor, ...
Last week was Earth Week, and together with more than 400 companies, ERS participated in the Time for Climate Action campaign and introduced its Sustainability Initiative to the public. Sophia Oldeide, who has been appointed as Climate Officer, told us how this initiative came about and the process of coordinating ...
APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system comes with a new series of high-performance chillers that have three default on-site configurable modes, each ...
