New generation of Debonders and Warpage Adjusters boosts productivity

The ERS ADM330 is designed for the thermal debonding of eWLB style wafers without human intervention at high precision and with unmatched repeatability, resulting in high and predictable process quality and thus guaranteeing high yield. The two handling robots accept wafers with a maximum warpage of +/- 5 mm; after ...

ERS boosts productivity in FOWLP debonding and wafer testing

ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16). ERS is resuming its presence at Semicon China after 12 years with the ...

ERS Competence Center celebrates fifth anniversary

“In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented”, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its ...

ERS ready for imminent eWLB upswing

eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with ...

ERS extends CLIC Partnership to Mainland China

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is extending its partnership with Taiwan-based Chain Logic International Corp. (CLIC) to the market of mainland China. With this move, the proven and fruitful collaboration with CLIC on the Taiwanese market finds its logical ...
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