New air-only applications from ERS bring higher throughput to wafer thermal test

ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this year from the German high-tech company will make the native advantages of this technology available to applications beyond ...

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

One and a half years after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors.  The ERS lab provides the opportunity to utilize ERS’ latest tools ...

ERS displayed sub-zero module of its new AirCool®3 System in Tokyo

ERS presented its new wafer thermal test system – the ERS AirCool®3 – during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products – AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool®products, the AirCool®3 exclusively uses air for cooling and ...
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