Where can you meet ERS?

ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on meetus@ers-gmbh.de.

 

Event Calendar 2022:

 

Semicon Korea

February 9th – 11th, Korea World Trade Tower, Seoul, Korea

Co-exhibiting with Korean channel partner Woowon Technology Co. Ltd. in Booth A410

 

Wafer Level Packaging Symposium

February 15th – 17th, DoubleTree by Hilton San Jose, San Jose CA, US

Exhibiting in Booth 13

 

Device Packaging Conference by IMAPS

March 7th – 10th, WeKoPa Resort and Conference Center, Fountain Hills AZ, US

Presentation: “FOWLP Thermal Debonding: Easing Manufacturing Constraints” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez

 

SW Test

June 5th – 8th, Omni La Costa, Carlsbad CA, US

 

Electronics System-Integration Technology Conference

September 13th – 16th, Sibiu, Romania

Presentation: ” Thermal Debonding: A Fundamental to Fan-out Manufacturing” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez

 

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