Where can you meet ERS?

ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on meetus@ers-gmbh.de.


Event Calendar 2022:


Semicon Korea

February 9th – 11th, Korea World Trade Tower, Seoul, Korea

Co-exhibiting with Korean channel partner Woowon Technology Co. Ltd. in Booth A410


Wafer Level Packaging Symposium

February 15th – 17th, DoubleTree by Hilton San Jose, San Jose CA, US

Exhibiting in Booth 13


Device Packaging Conference by IMAPS

March 7th – 10th, WeKoPa Resort and Conference Center, Fountain Hills AZ, US

Presentation: “FOWLP Thermal Debonding: Easing Manufacturing Constraints” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez


SW Test San Diego

June 5th – 8th, Omni La Costa, Carlsbad CA, US

Presentation: “Automated temperature calibration: Tackling the challenge of temperature accuracy and uniformity measurements in wafer probing” by Head of Software and Electronics, Bengt Haunerland


Electronics System-Integration Technology Conference

September 13th – 16th, Sibiu, Romania

Presentation: “Thermal Debonding: A Fundamental to Fan-out Manufacturing” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez


SW Test Asia

October 26th – 28th, Sheraton Hsinchu Hotel, Zhubei City, Taiwan


TestConX China (virtual)

November 1st – 3rd, online

Presentation: “New Method of Wafer Test under Temperature with High Wattage Dissipation” by Joshua Zhou, Vice President and Head of ERS Greater China


China Semiconductor Packaging & Test Seminar

November 15th – 16th, Nantong, Jiangsu, China

Presentation: “Thermal Debonding: A Fundamental to Fan-Out’s Reconstruction Process” by Wenxuan Song, Senior Application Engineer


Semicon Europa

Hall C1, Booth 440

November 15th – 18th, Messe München, Germany



Booth 10

December 7th – December 9th, Singapore


Semicon Japan

Booth #3213

December 14th – December 16th, Tokyo Big Sight, Japan


ICCAD (China Semiconductor Industry Association IC Design Branch) 2022

December 25th – 26th, Xiamen, China

Presentation: “ERS Precision Thermal Management Systems Assist Wafer Probing and Packaging” by Kang Zhao, ERS Greater China Product Manager