ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on meetus@ers-gmbh.de.
Event Calendar 2022:
Semicon Korea
February 9th – 11th, Korea World Trade Tower, Seoul, Korea
Co-exhibiting with Korean channel partner Woowon Technology Co. Ltd. in Booth A410
Wafer Level Packaging Symposium
February 15th – 17th, DoubleTree by Hilton San Jose, San Jose CA, US
Exhibiting in Booth 13
Device Packaging Conference by IMAPS
March 7th – 10th, WeKoPa Resort and Conference Center, Fountain Hills AZ, US
Presentation: “FOWLP Thermal Debonding: Easing Manufacturing Constraints” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez
SW Test San Diego
June 5th – 8th, Omni La Costa, Carlsbad CA, US
Presentation: “Automated temperature calibration: Tackling the challenge of temperature accuracy and uniformity measurements in wafer probing” by Head of Software and Electronics, Bengt Haunerland
Electronics System-Integration Technology Conference
September 13th – 16th, Sibiu, Romania
Presentation: “Thermal Debonding: A Fundamental to Fan-out Manufacturing” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez
SW Test Asia
October 26th – 28th, Sheraton Hsinchu Hotel, Zhubei City, Taiwan
TestConX China (virtual)
November 1st – 3rd, online
Presentation: “New Method of Wafer Test under Temperature with High Wattage Dissipation” by Joshua Zhou, Vice President and Head of ERS Greater China
China Semiconductor Packaging & Test Seminar
November 15th – 16th, Nantong, Jiangsu, China
Presentation: “Thermal Debonding: A Fundamental to Fan-Out’s Reconstruction Process” by Wenxuan Song, Senior Application Engineer
Semicon Europa
Hall C1, Booth 440
November 15th – 18th, Messe München, Germany
EPTC
Booth 10
December 7th – December 9th, Singapore
Semicon Japan
Booth #3213
December 14th – December 16th, Tokyo Big Sight, Japan
ICCAD (China Semiconductor Industry Association IC Design Branch) 2022
December 25th – 26th, Xiamen, China
Presentation: “ERS Precision Thermal Management Systems Assist Wafer Probing and Packaging” by Kang Zhao, ERS Greater China Product Manager