ERS electronic Opens Demonstration Center in Zhubei to Meet Growing Demand for Panel-Level Packaging in Taiwan

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is excited to announce the opening of its latest demonstration center in Zhubei, Taiwan. This new facility will offer chipmakers and OSATs in Taiwan direct access to ERS’s PhotoThermal debonding machine for wafers and panels, LUM600S1, a strategic ...

ERS online TechTalk on Advanced Packaging Activities in Europe

With the increasing demand for high-performance computing, AI, and energy-efficient electronics, Advanced Packaging has become a key enabler of innovation. Recognizing its strategic importance, Europe is ramping up efforts to strengthen its position in this field—through investments, collaborations, and new initiatives aimed at boosting local capabilities. Last week, ERS celebrated ...

ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany

Today, ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its new state-of-the-art production and R&D facility, coupled with a cutting-edge Competence Center for Advanced Packaging and Advanced Backend technologies. This strategic expansion marks a significant milestone in ERS’s commitment ...

ERS electronic Appoints Global Marketing Services, India as New Channel Partner

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is expanding its global network of distributors by appointing Global Marketing Services (GMS), India as regional channel partner for the Indian market. This strategic partnership will enhance the availability of ERS’s innovative solutions across India, providing critical support ...

Enhance Your Manufacturing Precision and Throughput with Wave3000’s Cutting-Edge Features

In the evolving landscape of semiconductor manufacturing, Fan-Out Wafer Level Packaging (FOWLP) has emerged as a transformative technology, offering substantial benefits such as enhanced electrical performance, reduced form factor, and cost-efficiency. However, FOWLP also introduces significant challenges, particularly related to deformation and wafer warpage. Effective management of these issues is ...