Tag: semiconductor (Page 1 of 4)

ERS online TechTalk on Advanced Packaging Activities in Europe

Join the ERS TechTalk on Advanced Packaging Activities in Europe! Date: February 25th Time: 9:00 – 10:15 CET Location: Online Our Head of Advanced Packaging Equipment Solutions, Debbie Claire Sanchez, will be joined by Dr.Tanja Braun, Sylvie Joly, and Steffen Kröhnert to discuss the latest trends and developments shaping the ...

ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany

Today, ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its new state-of-the-art production and R&D facility, coupled with a cutting-edge Competence Center for Advanced Packaging and Advanced Backend technologies. This strategic expansion marks a significant milestone in ERS’s commitment ...

ERS electronic Appoints Global Marketing Services, India as New Channel Partner

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is expanding its global network of distributors by appointing Global Marketing Services (GMS), India as regional channel partner for the Indian market. This strategic partnership will enhance the availability of ERS’s innovative solutions across India, providing critical support ...

Enhance Your Manufacturing Precision and Throughput with Wave3000’s Cutting-Edge Features

In the evolving landscape of semiconductor manufacturing, Fan-Out Wafer Level Packaging (FOWLP) has emerged as a transformative technology, offering substantial benefits such as enhanced electrical performance, reduced form factor, and cost-efficiency. However, FOWLP also introduces significant challenges, particularly related to deformation and wafer warpage. Effective management of these issues is ...

ERS electronic releases fully automatic Luminex machines with PhotoThermal debonding and wafer cleaning capability

ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, is announcing two new fully automatic machines from its Luminex product line. The machines, LUM300A1 and LUM300A2, are designed to handle 300 mm substrates and are both featuring ERS’s state-of-the-art PhotoThermal debonding technology that offers unparalleled flexibility, cost-effectiveness ...