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ERS introduces Wave3000, a State-of-the-Art Warpage Metrology Tool for Advanced Packaging Wafers
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to its advanced optical scanning methodology, Wave3000 can accurately measure wafer deformities in specific handling positions that provides a comprehensive and ...
PulseForge and ERS electronic Collaborate to Bring Fully-Automated Photonic Debonding Tool to the Semiconductor Industry
PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a fully-automated photonic debonding solution to the semiconductor industry. This collaboration brings together the industry leader in thermal management solutions for semiconductor manufacturing, ERS electronic, and an industry innovator in applied thermal energy, PulseForge, Inc. ERS electronic ...
ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330
NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction. Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies. However, wafer deformity, also called “warpage” ...
convERSations: Bengt Haunerland
Q: You are our Head of Software and Electronics, and have been working on the development of our latest innovation, ProbeSense™, for the past two years. Where did this idea come from, and what were some of the biggest challenges in the development process? Bengt: The project basically started with ...