ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world’s leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous ...
Effective immediately, Laurent Giai-Miniet is the new Chief Sales and Marketing Officer, (CSMO) at ERS electronic GmbH, the world leading provider of thermal test solutions for semiconductor manufacturing. Laurent Giai-Miniet brings more than 25 years of experience in the semiconductor, global electronics and internet of Things spaces. Laurent has held ...
The ERS ADM330 is designed for the thermal debonding of eWLB style wafers without human intervention at high precision and with unmatched repeatability, resulting in high and predictable process quality and thus guaranteeing high yield. The two handling robots accept wafers with a maximum warpage of +/- 5 mm; after ...
ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16). ERS is resuming its presence at Semicon China after 12 years with the ...
“In retrospect, the decision to launch this Competence Center five years ago has been very fruitful and future-oriented”, says ERS Managing Director Klemens Reitinger. Though the technology has made significant progress, some fundamental issues persist – in particular those related to the proper separation of the reconstituted wafer from its ...
