Category: News (Page 11 of 14)

ERS welcomes Regine Beckmann as new Channel Marketing and Internal Sales manager

ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is proud to announce that Regine Beckmann will, as of July, work as their new Channel Marketing and Internal Sales manager. Beckmann has more than 15 years of international sales and account management experience from ...

ERS’ CTO gives a lecture at the Advanced Packaging & System Integration Technology Symposium

Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP. “I’m very excited about the ...

AirCool® PRIME Thermal Chuck technology will soon be available for 200 mm wafer testing

ERS electronic GmbH, the industry leader in the market of thermal test solutions for semiconductor production, is today announcing that its AirCool®PRIME...

ERS appoints Joshua Zhou as Sales and Marketing director in China

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, announced today that it has appointed Joshua Zhou as Sales and Marketing Director, China. He will be based in Shanghai and will focus on growing ERS’ business in China. Zhou is certainly qualified for ...

CSR article – Reducing wafer test time

Reducing wafer test time Our CEO Klemens Reitinger has contributed to the Jan/Feb issue of Chip Scale Review magazine with an article discussing the importance of reducing wafer test time. “This article will explain why it is so important to generate new solutions that reduce the expensive waiting time in ...
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