Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP. “I’m very excited about the ...
ERS electronic GmbH, the industry leader in the market of thermal test solutions for semiconductor production, is today announcing that its AirCool®PRIME...
ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, announced today that it has appointed Joshua Zhou as Sales and Marketing Director, China. He will be based in Shanghai and will focus on growing ERS’ business in China. Zhou is certainly qualified for ...
Reducing wafer test time Our CEO Klemens Reitinger has contributed to the Jan/Feb issue of Chip Scale Review magazine with an article discussing the importance of reducing wafer test time. “This article will explain why it is so important to generate new solutions that reduce the expensive waiting time in ...
ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is announcing a major innovation in its product range of thermal test solutions for the semiconductor industry, significantly boosting user flexibility and cost effectiveness. The new AirCool PRIME family of thermal chucks, developed in ...
