ERS and MPI’s AirCool® PRIME Thermal Chucks recognized at the Electronics Industry Awards 2018

Tuesday evening, during the Electronics Industry Awards ceremony held in Birmingham (UK), ERS and MPI’s joint product AirCool® PRIME Chuck won an award in the category, “Test, Measurement and Inspection Product of the year”.

The awards show was organised by Datateam Business Media in association with CIE Magazine, Electronics magazine and ECSN. Businesses, products and people that have made an impact on the electronics industry in the past year were nominated in different categories, where the winners were chosen based on votes from people in the electronics industry.

AirCool® PRIME was originally announced during last year’s SEMICON Europa in Munich in November. The PRIME thermal chuck family, which was co-developed with the engineering probe station manufacturer MPI Corporation, combines the newest innovations in thermal test and offers temperature testing ranging from -65°C to +300°C. Thanks to the ERS PRIME Thermo Shield (PTS), the AirCool® PRIME chuck system offers ‘best in class’ soaking times, and has become an industry favourite for customers wishing to perform Ultra-Low Noise measurements requiring very fast transition times.

We are delighted to see the fruits of our partnered development with MPI recognized by the industry. PRIME 300mm now represents a large part of our shipments in the engineering market and we can’t wait to release its sibling offer, PRIME 200mm, that we plan to ramp to production early next year.” says Laurent Giai-Miniet CEO & CSMO of ERS electronic GmbH.

Reducing the thermal soaking time by 2/3, the transition time by 1/5, enabling testing under inert-gas atmosphere together with the unique field upgradability are the key values of the PRIME thermal chuck systems,” says Stojan Kanev, General Manager of Advanced Semiconductor Test Division at MPI Corporation. “PRIME chucks and MPI probe stations, such as the TS3000-SE, have for the first time ever been developed together by two leading high-tech companies resulting in a great unified entity.”

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