eWLB (Embedded Wafer-Level Ball Grid Array) is a very economical packaging technology for the advanced semiconductor solutions required for innovative application areas such as Internet of Things, sensors, automation and mobility. It enables semiconductor manufacturers to create chips with smaller footprint, thinner package and better electrical properties than possible with ...
ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor production, is extending its partnership with Taiwan-based Chain Logic International Corp. (CLIC) to the market of mainland China. With this move, the proven and fruitful collaboration with CLIC on the Taiwanese market finds its logical ...
TÜV Deutschland, a recognized expert for helping high-tech companies comply with industry standards and regulations, awarded ERS electronic GmbH the ISO9001:2008 recertification. The certification is valid until September 2018. ISO, the International Organization for Standardization (www.iso.org), is the world’s largest developer and publisher of International Standards established by a membership ...
ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic’s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster. DTS is an add-on to ERS’ existing wafer chuck ...
ERS electronic GmbH, market leader in the field of thermal wafer chucks in semiconductor production, is broadening the range of applications for its proven air-only cooling technology. New products coming out this year from the German high-tech company will make the native advantages of this technology available to applications beyond ...
