Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP.
“I’m very excited about the opportunity to present at the Yole and NCAP Symposium and share my experience in FOWLP debonding and warpage adjust. I also look forward to meeting my industry peers” says Mr. Reitinger. “The market for small/mid density FOWLP is booming, and ERS’ advanced solutions for the eWLB remain state-of-the-art. Millions of eWLB wafers were already processed on ERS machines, representing billions of ICs.”
This marks the fourth year that the popular symposium, powered by Yole Développement (Yole) and hosted by NCAP China, will be held.
“Yole is pleased to welcome Klemens Reitinger as a speaker at its Advanced Packaging and System Integration Technology Symposium, in the FOWLP session”, states Thibault Buisson, General Manager at Yole. “In such a dynamic ecosystem and with the impressive FOWLP adoption by the semiconductor industry, Yole and its partner NCAP China offer an invaluable Symposium for all leaders in this industry. ERS Electronic, in addition to other speakers, will share their vision of the market, the technology trends and business opportunities. Yole and NCAP China are delighted to welcome such significant speakers for this 4th edition, and are sure that the attendees will appreciate the numerous and varied presentations and networking sessions”.
ERS electronic’s presentation will take place on Thursday from 9:25am to 9:50am at Hotel Nikko in Wuxi, China.
ERS electronic GmbH, based around Munich, has been producing innovative thermal test solutions for the industry for nearly 50 years. The company has gained an outstanding reputation in the sector, notably with its fast and accurate air cool-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing tests. Today, thermal chuck systems developed by ERS such as AC3, AirCool® PRIME, AirCool® and PowerSense® are integral components in all larger-sized wafer probers across the semiconductor industry.
About the Advanced Packaging & System Integration Technology Symposium (June 20&21, 2018 – Wuxi, China)
After the three last successful events, Yole Développement (Yole) & NCAP have decided to continue and strengthen the collaboration to organize the Advanced Packaging & System Integration Technology Symposium for the 4th time. The advanced packaging is on the move. Emerging application are bringing new challenges, and packaging experts from all over the world will come to exchange on their vision and future perspectives. Don’t miss it!
During 2 days, all packaging aspects including Panel Level, Fan Out, System in Package, Advanced Substrates, 3D Technology will be discussed. Focus on key applications such as 5G, Automotive, Artificial Intelligence and Memory will be at the heart of the conference.