The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor ...
ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces the addition of Spirox Technology Co., Ltd. as a new sales channel partner. Spirox will help ERS electronic GmbH to deliver highly-differentiated thermal solutions to the fast-growing number of semiconductor companies in China. ...
ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces a major innovation in its revolutionary AC3 AirCool® only product line; the High Thermal Uniformity (HTU) line brings a new range of wafer temperature probing capabilities to the semiconductor industry. With the new ...
ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, is proud to announce that effective immediately Debbie Claire Sanchez is becoming the Strategic Product Manager for its FOWLP product line in Germering, Germany. In hiring Debbie Claire Sanchez, ERS is gaining a distinguished ...
Tuesday evening, during the Electronics Industry Awards ceremony held in Birmingham (UK), ERS and MPI’s joint product AirCool® PRIME Chuck won an award in the category, “Test, Measurement and Inspection Product of the year”. The awards show was organised by Datateam Business Media in association with CIE Magazine, Electronics magazine ...
