Category: Featured (Page 2 of 7)

ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features

March 30th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and ...

ERS electronic appoints Mark Wachter as Chief Financial Officer

January 13th, 2022 – ERS electronic, the world leader in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark Wachter as Chief Financial Officer of the company. Following its strong financial performance and all-time high revenue in 2021, ERS is expanding its C-level executive team ...

convERSations: Laurent Giai-Miniet

Laurent first joined ERS in 2016 as a consultant in what was supposed to be a short-term engagement. However, he ended up joining the company as CSMO in 2017, and a year later he became co-CEO of the company. It’s been almost five years since he made the decision to ...

ERS now offers its technology for Fan-out Debonding and Warpage Adjustment in a fully-automatic machine for panels up to 650 x 650 mm

ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018, ...

convERSations: Ronny Wagner

Shortly after joining our company in 2007, Ronny was asked to help us develop the first-ever Thermal Debonding station. Over the past almost 15 years he has worked on every Fan-out machine that ERS has developed and has travelled all over the world to install and service the machines at ...