ERS’ CTO gives a lecture at the Advanced Packaging & System Integration Technology Symposium

Klemens Reitinger, CTO and CEO of ERS electronic GmbH, will be attending this year’s advanced packaging and integrated system symposium, where he will be giving a presentation on thermal debonding and warpage correction, drawing from ERS’ 10+ years of experience in the arena of FOWLP. “I’m very excited about the ...

SWTW Workshop in San Diego

Meet us in San Diego! June 3 – June 6, 2018 Rancho Bernardo Inn, San Diego, California Tent – #26 Schedule a meeting

ERS electronic is exhibiting at SEMICON China for the first time

ERS electronic GmbH will be exhibiting at SEMICON China with its own booth for the first time in its long history as a supplier of industry-leading thermal test solutions to the semiconductor industry. With the goal of enhancing its support to its customer base in China, ERS is announcing that ...

ERS electronic will showcase manufacturing innovation at Semicon Europa

ERS electronic GmbH, the innovation leader in the market of thermal test solutions for semiconductor manufacturing, will be showcasing their innovative technology at Semicon Europa. Together with Productronica, the world’s leading manufacturing trade fair held in parallel, the event is the largest microelectronics meeting place in Europe. For ERS’ numerous ...

ERS boosts productivity in FOWLP debonding and wafer testing

ERS electronic GmbH, the innovation leader in the market of Fan-out Wafer-Level Packaging (FOWLP) debonding and thermal test solutions for semiconductor production, will showcase its latest technology developments at Semicon China in Shanghai (March 14 – 16). ERS is resuming its presence at Semicon China after 12 years with the ...