ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

One and a half years after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors.  The ERS lab provides the opportunity to utilize ERS’ latest tools ...

ERS displayed sub-zero module of its new AirCool®3 System in Tokyo

ERS presented its new wafer thermal test system – the ERS AirCool®3 – during the Semicon Japan 2011. The AirCool®3 combines the advantage of the two ERS flagship products – AirCool® and AirCool®plus in one modular system. As with the other ERS AirCool®products, the AirCool®3 exclusively uses air for cooling and ...