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ERS electronic GmbH at ITWS
Meet us in Freising! May 6 – May 7, 2019 ERS electronic is excited to participate in ITWS11, where ERS electronic GmbH’s CEO &CTO Klemens Reitinger will deliver a presentation on “Absolute Temperature Accuracy, The Rising Trend Of Wafer Testing – Where Are We Today?.”
ERS electronic GmbH at NCAP
Meet us in NCAP Shanghai! April 22 – April 23, 2019 ERS electronic is excited to participate in the 2019 Yole Développement and NCAP Advanced Packaging & System Integration Technology Symposium, which is taking place at the Grand Mercure Shanghai Century Park Hotel, from April 22 – 23. ERS’ Debbie ...
ERS electronic GmbH at SEMICON China
Meet us in Shanghai! March 20 – March 22, 2019 Shanghai New International Expo Centre, Hall-4, Booth-4386
ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700
The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor ...