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ERS stellt Wave3000 vor, ein innovatives Messgerät für die Messung von Warpage für Advanced Packaging Wafer
ERS electronic, Branchenführer im Bereich Wärmemanagementlösungen für die Halbleiterfertigung, hat eine einzigartige Maschine für die Messung und Analyse von verworfenen Wafern entwickelt. Dank seiner fortschrittlichen optischen Scan-Methode kann Wave3000 die Wölbung (oder “Warpage”) von Wafern in bestimmten Handling-Positionen genau messen und so eine umfassende und präzise Analyse der Wafer-Wölbung liefern, ...
PulseForge and ERS electronic Collaborate to Bring Fully-Automated Photonic Debonding Tool to the Semiconductor Industry
PulseForge, Inc. and ERS electronic GmbH have announced a strategic alliance to bring a fully-automated photonic debonding solution to the semiconductor industry. This collaboration brings together the industry leader in thermal management solutions for semiconductor manufacturing, ERS electronic, and an industry innovator in applied thermal energy, PulseForge, Inc. ERS electronic ...
Where can you meet ERS?
ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on info@ers-gmbh.de. Event Calendar 2024: Semicon Korea January 31st – February 2nd, COEX, Seoul, Korea Co-exhibiting with Korean channel ...
ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330
NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction. Fan-out Wafer Level Packaging (FoWLP) is one of the most prominent Advanced Packaging technologies. However, wafer deformity, also called “warpage” ...