ERS electronic will be attending and presenting at this year’s Hybrid SW Test from August 30th to September 1st. The physical event location is San Diego, California, but it will also be possible to attend the event online. Our CTO Klemens Reitinger will be presenting on the topic of „High ...
Debbie joined ERS in 2018, has worked for more than seven years in the field of wafer-level packaging, both Fan-in, and Fan-out, and is driving the development of ERS’ Thermal Debonding and Warpage Adjustment equipment for Fan-out applications. We talked to her last week and asked her about her reasons ...
ERS electronic will be attending and presenting at this year’s SYNAPS (Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors), which takes place online from May 18th to 20th. Our Fan-out Equipment Business Unit manager Debbie-Claire Sanchez will present our latest research on Fan-out Wafer Level Packaging, titled ...
Hast du dich jemals gefragt, wie dein Smartphone dein Gesicht innerhalb von Millisekunden erkennen kann? Oder wie manche Autos sich selbst steuern können? Und dein Kühlschrank? Wie schafft er es, die perfekte kühle Temperatur zu halten, anstatt dein ganzes Gemüse zu Eis gefrieren zu lassen? Die Antwort lautet: Halbleiter. Am ...
ERS electronic, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is appointing Joshua Zhou as Vice President. Zhou joined the company as Sales and Marketing Director in 2018 when ERS opened its China sales office in Shanghai. Joshua has more than twenty years of experience in ...