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ERS electronic introduces ProbeSense™, a state-of-the-art measurement device for automated temperature calibration in wafer test
MAY 24th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a temperature calibration device that allows automatic and highly accurate measurements below 30mK in the actual probing area. The patent-pending device, aptly named ProbeSense™, consists of a temperature sensor, ...
ERS electronic announces the AC3 Fusion thermal chuck system, a versatile and more sustainable solution for temperature test in wafer probing
APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system comes with a new series of high-performance chillers that have three default on-site configurable modes, each ...
convERSations: Regine Beckmann
Regine Beckmann is our Regional Sales Manager for Europe and Asia. We talked to her about the recent activity in Europe following the EU Commission’s announcement of the EU Chips Act, and how ERS may help OSATs and manufacturing companies establish in the region. Q: Before joining ERS, you previously ...
ERS electronic unveils the Next-Generation of its ADM330 with a new design and advanced features
March 30th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and ...