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Global leader in thermal management solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold more than 7,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 2 billion ICs have been debonded on ERS solutions.

ERS has been recognized as Equipment Supplier of the Year by 3D inCites for its contribution to the development of heterogeneous integration and 3D technologies.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®, HTU

Debonding Solutions

Generation 3 of our flagship machine ADM330 is available now!

04 Oct 2021 Where can you meet ERS? ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us...

16 Nov 2022 ERS electronic offers improved warpage correction performance for Fan-out Wafer-Level Packaging with its Next-Generation WAT330 NOVEMBER 15th, 2022 – ERS electronic, the industry leader in thermal management solutions for semiconductor manufacturing, upgrades its Warpage Adjustment Tool (WAT330), to include powerful capabilities for warpage measurement and correction....

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.