Invention
Evolution
Innovation

Global leader in thermal chuck solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®

More about thermal chucks

Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

More about thermal debonding

10 Sep 2018 ERS at SW Test Asia Meet us in Hsinchu! October 18 – October 19, 2018 Sheraton Hsinchu Hotel

28 Sep 2018 ERS and MPI’s AirCool® PRIME Thermal Chucks recognized at the Electronics Industry Awards 2018 Tuesday evening, during the Electronics Industry Awards ceremony held in Birmingham (UK), ERS and MPI’s joint product AirCool® PRIME Chuck won an award in the category, “Test, Measurement and Inspection...

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.