Invention
Evolution
Innovation

Global leader in thermal chuck solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®, HTU

More about thermal chucks

Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

More about thermal debonding

19 Nov 2019 ERS at SEMICON Japan 2019 Meet us at SEMICON Japan 2019 (11th – 13th December) We are proud to announce that we shall be exhibiting at SEMICON Japan 2019 (11th – 13th December) and Tokyo...

13 Nov 2019 ERS’ Thermal Chucks Will Be Available In SEMICS’ Renowned OPUS3 Product Line of Manufacturing Probers ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor manufacturing industry, is pleased to announce a new engagement with the Korean semiconductor equipment supplier, SEMICS Inc....

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.