Wave3000

Warpage Metrology Tool

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Global leader in thermal management solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold more than 7,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 2 billion ICs have been debonded on ERS solutions.

Thermal Chuck Systems

AirCool® Prime,
AC3 Fusion, AirCool®

Debonding Solutions

Generation 3 of our flagship machine ADM330 is available now!

09 Jan 2023 Where can you meet ERS? ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us...

30 May 2023 ERS introduces Wave3000, a State-of-the-Art Warpage Metrology Tool for Advanced Packaging Wafers ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, has developed a first-of-its-kind equipment for the metrology and analysis of warped wafers. Thanks to...

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