ERS electronic GmbH at NCAP

ERS electronic GmbH at NCAP
Meet us in NCAP Shanghai! April 22 – April 23, 2019 ERS electronic is excited to participate in the 2019 Yole Développement and NCAP Advanced Packaging & System Integration Technology Symposium, which is taking place at the Grand Mercure Shanghai Century Park Hotel, from April 22 – 23. ERS’ Debbie…

ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700

ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700
The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding capabilities and even more powerful warpage adjustment. ERS electronic GmbH, the innovation leader in thermal management solutions for the semiconductor…
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