Invention
Evolution
Innovation

Global leader in thermal chuck solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®

More about thermal chucks

Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

More about thermal debonding

11 Jan 2019 ERS at SEMICON Korea Meet us in Seoul! January 23 – January 24, 2018 Korea World Trade Tower, Booth-A504, Hall-A.

18 Jan 2019 ERS electronic GmbH takes the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700 The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERS´s complete range of thermal debonding...

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.