Invention
Evolution
Innovation

Global leader in thermal chuck solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®

More about thermal chucks

Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

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26 Oct 2018 ERS at Semicon Europa Munich Meet us in Munich! November 13 – November 16, 2018 Neue Messe München, Hall-A4/Booth-651

19 Nov 2018 Announcing a new flavor in ERS AC3 Thermal Chucks, the High-Thermal Uniformity (HTU) product line. ERS electronic GmbH, the innovation leader in the market of thermal management solutions for semiconductor manufacturing, announces a major innovation in its revolutionary AC3 AirCool® only product line; the High...

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.