Invention
Evolution
Innovation

Global leader in thermal management solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold more than 6,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 2 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®, HTU

More about thermal chucks

Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

More about thermal debonding

08 Jan 2020 ERS at SEMICON Korea 2020 Meet us at SEMICON Korea 2020 (5th – 7th February) We are proud to announce that we shall be exhibiting at SEMICON Korea 2020 (5th – 7th February) at COEX,...

15 Jan 2020 ERS Thermal Chuck article in Markt&Technik Daily Magazine – SEMICON Europa 2019 ERS Thermal Chuck article During SEMICON Europa 2019, ERS was featured in the daily Markt&Technik magazine, with an article all about our Thermal Chucks. Click the link above to read...

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.