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Global leader in thermal management solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold more than 7,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 2 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®, HTU

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Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

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26 Apr 2021 ERS at SYNAPS 2021! ERS electronic will be attending and presenting at this year’s SYNAPS (Symposium by Yole Développement and NCAP on Advanced Packaging for Semiconductors), which takes place online from May 18th to...

02 Jun 2021 convERSations: Debbie-Claire Sanchez Debbie joined ERS in 2018, has worked for more than seven years in the field of wafer-level packaging, both Fan-in, and Fan-out, and is driving the development of ERS’ Thermal...

Open
Positions

Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.