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Global leader in thermal management solutions

We pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.
We have sold more than 6,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 2 billion ICs have been debonded on ERS solutions.

Thermal Chucks

AirCool® Prime,
AC3, AirCool®, HTU

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Debonding Solutions

Thermal debonding solutions based on our patented AirCool® technology

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27 Apr 2020 ERS at SEMICON China 2020 Meet us at SEMICON China 2020 (27th – 29th June) Once again, ERS will be attending SEMICON China in the Shanghai New International Expo Centre. Find us in Hall E3,...

14 May 2020 ERS electronic adds PRIME 200 to their AirCool® thermal chuck family ERS electronic GmbH, the industry-leading manufacturer of thermal management solutions for the semiconductor market will offer its customer-favourite AirCool® PRIME for 200 mm wafer format. Following the success of the...

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Working at ERS is more than just a job. We are looking for passionate, collaborative and driven people. Want to come along for the ride?

Mastering
the 5th
Dimension

Learn more about our technology, innovations and quality assurance.