The ERS MPDM700 System is ideal for the separation of the panel from its carrier related to the FOPLP technology. The debonding of the thermal release bonding agents is performed. The system offers high repeatability of results with respect to the quality of the debonded wafer.
Its special vacuum design and the large range of operating temperatures (up to +240°C) allow the debonding of very thin panels and warpage correction of up to 10mm. Like the previous generation of ERS tools, the MPDM700 features a contactless and smooth transport mechanism, which enables the transport of the panels from one temperature zone to the other while repairing warpage.
This tool is specially designed for research and development laboratories or pilot lines during the ramp-up of new technology.
- FOPLP optimized thermal debonding
- FOPLP wafer warpage control
- Warpage adjust only mode
- MMI with touch screen
For special requirements, please contact us.