Meet us in NCAP Shanghai!
April 22 – April 23, 2019
ERS electronic is excited to participate in the 2019 Yole Développement and NCAP Advanced Packaging & System Integration Technology Symposium, which is taking place at the Grand Mercure Shanghai Century Park Hotel, from April 22 – 23. ERS’ Debbie Claire Sanchez Strategic Product Manager for FOWLP will deliver a presentation on “A Unique and Robust Technique to Eliminate Warpage for A Fan-out Packaged Device.”