Warpage Adjustment

Automatic Warpage Adjustment Station

The WAT is a fully automated warpage correction tool, providing optimal results with ERS’ TriTemp Slide technology

Description

The ERS WAT is a fully automatic tool for the thermal forming of 200 mm (WAT200) or 300/330 mm (WAT300/330) FOWLP wafers.  The specially-designed ERS TriTemp Slide® in this system makes it possible to successfully form a wide variety of FOWLP wafers at various stages in their processing and the resulting wafer shape can be matched to the handling specifications of the downstream tool.

The ERS WAT is able to process up to four FOUPs in a fully-automatic operation.  It is equipped with a Wafer-ID reader and an automatic warpage measurement station that enables a high flexibility with 3 separate operation modes.  It can be used strictly as a warpage measurement station, as a warpage adjustment station, or as a warpage measure/adjust/monitor station. The system is designed with a special environmental chamber that can be used to maintain a nitrogen envelope around the wafer during processing.

WAT

Technical data

Wafer Size
200 mm or 300/330 mm
Handling System
One 4-Axis Robot; special endeffector
Maximum Input Warpage
+/- 7mm
Warpage Adjust Method
ERS TriTemp Slide
Typical Output warpage
< 500µm
Temperature Control
DC PID and ERS AirCool® components
Temperature Range
-10°C up to +260°C (depending on station)
Oxygen Free Environment
Optional

Dimensions

W x D x H
2273 x 1134 x 1741 mm
Weight
1800kg

Facility Supply

Voltage
400 VAC 3-phase 32A
Frequency
50 / 60 Hz
Power
18 kW
CDA Pressure
6 bar at 0 °C dew point
CDA Flow Rate
1000 l/min peak
Vacuum Pressure
100 mbar
Vacuum Flow Rate
100 l/min

For special requirements, please contact us.