DESCRIPTION
Beyond thermal chucks for wafer probing, mainly 300 mm and 200 mm round format, ERS also provides special developments for demanding applications. On your request, ERS offers special vacuum designs that meet your requirements, be it for MEMS wafer testing, low RDSon high voltage testing or warped wafer handling.
The strong vacuum chuck is recommended for use in ERS chuck systems when testing highly warped wafers. At a certain degree of warpage and wafer thickness, the wafer will react to the temperature causing the vacuum to fail. The combination of our strong vacuum technology and special vacuum layout will overcome this reaction, allowing the wafer to lay flat on the chuck.
