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Wafer Probing
Our Thermal Chucks
AirCool®
AC3
AirCool® PRIME
Our Solutions
High Thermal Uniformity / Accuracy
High Power Dissipation
Anti-Magnetic
High Voltage / Current
Ultra Low Noise
Special Vacuum Design
Integration & Sealing
ProbeSense™
Advanced Packaging
PhotoThermal Debonding
Automatic Luminex – LUM300A
Semi-Automatic Luminex – LUM600S1
Thermal Debonding
Automatic Debond Machine
Automatic Panel Debond Machine
Manual Debond Machine
Manual Panel Debond Machine
Warpage Adjustment
Automatic Warpage Adjust Tool
Manual Warpage Adjust Tool
3D Wafer Profiler – Wave 3000
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Our Team
Innovation, History and Quality
Sustainability
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January 18, 2019
June 11, 2024
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English
Deutsch
简体中文
日本語
Wafer Probing
Our Thermal Chucks
AirCool®
AC3
AirCool® PRIME
Our Solutions
High Thermal Uniformity / Accuracy
High Power Dissipation
Anti-Magnetic
High Voltage / Current
Ultra Low Noise
Special Vacuum Design
Integration & Sealing
ProbeSense™
Advanced Packaging
PhotoThermal Debonding
Automatic Luminex – LUM300A
Semi-Automatic Luminex – LUM600S1
Thermal Debonding
Automatic Debond Machine
Automatic Panel Debond Machine
Manual Debond Machine
Manual Panel Debond Machine
Warpage Adjustment
Automatic Warpage Adjust Tool
Manual Warpage Adjust Tool
3D Wafer Profiler – Wave 3000
About
Our Team
Innovation, History and Quality
Sustainability
News & Events
Career
Contact Us
Sales Wafer Probing
Sales Advanced Packaging
Support
Apply
