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  • April 9, 2024

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  • English
    • Deutsch
    • 简体中文
    • 日本語
  • Wafer Probing
    • Our Thermal Chucks
      • AirCool®
      • AC3
      • AirCool® PRIME
    • Our Solutions
      • High Thermal Uniformity / Accuracy
      • High Power Dissipation
      • Anti-Magnetic
      • High Voltage / Current
      • Ultra Low Noise
      • Special Vacuum Design
      • Integration & Sealing
    • ProbeSense™
  • Advanced Packaging
    • PhotoThermal Debonding
      • Automatic Luminex – LUM300A
      • Semi-Automatic Luminex – LUM600S1
    • Thermal Debonding
      • Automatic Debond Machine
      • Automatic Panel Debond Machine
      • Manual Debond Machine
      • Manual Panel Debond Machine
    • Warpage Adjustment
      • Automatic Warpage Adjust Tool
      • Manual Warpage Adjust Tool
    • 3D Wafer Profiler – Wave 3000
  • About
    • Our Team
    • Innovation, History and Quality
    • Sustainability
  • News & Events
  • Career
  • Contact Us
    • Sales Wafer Probing
    • Sales Advanced Packaging
    • Support
    • Apply