Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test

Dynamic Thermal Shield: Higher Throughput and More Reliable Results in Wafer Test
ERS electronic GmbH, technology leader in air-cooled chuck systems for semiconductor manufacturing, is announcing a technology break-through that significantly improves measurement precision during wafer test. ERS electronic’s new Dynamic Thermal Shield (DTS) helps semiconductor manufacturers to achieve better test results faster. DTS is an add-on to ERS’ existing wafer chuck…

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market

ERS FOWLP Competence Center now supporting a growing and diverse advanced packaging market
One and a half years after its launch, ERS electronic GmbH’s FOWLP (Fan-out Wafer Level Packaging) competence center near Munich (Germany) is being utilized by an increasing number of semiconductor chip makers, research institutes, materials suppliers and packaging sub-contractors.  The ERS lab provides the opportunity to utilize ERS’ latest tools…
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