Thermal Debonding
ERS Thermal Debonders for Core Fan-out, HD FO and UHD FO technologies use Thermal Lift-off/Slide and patented contactless transport for clean debonding, detaping, and minimal warpage, perfect for wafers and large panels.
- Available as manual, semi-automated and fully automated machines
- Handles 200 mm/300 mm wafers & panels up to 650 x 650 mm
- Patented contactless transport to minimize induced warpage
- In-situ warpage correction
- Optional bonding station
ERS is trusted globally by IDMs, foundries, and OSATs for mission-critical wafer and panel processes.
