APRIL 22nd, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is introducing an extension of the renowned AC3 thermal chuck system, called Fusion. The system comes with a new series of high-performance chillers that have three default on-site configurable modes, each ...
March 30th, 2022 – ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as the first-of-its-kind. Since then, it has become an industry-favourite and ...
January 13th, 2022 – ERS electronic, the world leader in the market of thermal management solutions for semiconductor manufacturing, announces the appointment of Mark Wachter as Chief Financial Officer of the company. Following its strong financial performance and all-time high revenue in 2021, ERS is expanding its C-level executive team ...
Laurent first joined ERS in 2016 as a consultant in what was supposed to be a short-term engagement. However, he ended up joining the company as CSMO in 2017, and a year later he became co-CEO of the company. It’s been almost five years since he made the decision to ...
ERS electronic, the industry leader in the market of thermal management solutions for semiconductor manufacturing, is adding the Automatic Panel Debond Machine 650 (APDM650) to its portfolio of equipment for Advanced Packaging. ERS’s Manual Panel Debond Machine (MPDM), quickly gained traction in the industry after it was announced in 2018, ...
