Field Application Engineer – Advanced Packaging Equipment (m/f/d)

Based in Hsinchu, Taiwan.

Equipment Demonstration: Conduct in-depth equipment demonstrations tailored to the specific needs of potential clients.
Technical Training: Train both internal teams and external customers on equipment functionalities and best practices.
Customer Requirement Analysis: Analyse customer requirements for semiconductor packaging and recommend suitable equipment configurations.
Technical support to Sales: Work closely with Sales team and distributors to convert technical requirements into business contracts.
Trade Shows & Conferences: Represent the company at industry events, delivering technical presentations and networking to generate leads.
Close cooperation with customers in case of functional problems and making remote diagnoses
Diagnosis, parameterization and functional testing of defective machines
Installation and repair of systems at customer sites
Product Development Input: Contribute to R&D activities by providing customer feedback and industry requirements for new features and functionalities.
Travel within Taiwan and potentially APAC region (up to approx. 30% of working time)

Preferred Education: Bachelor’s or Master’s degree in Materials Science, electrical engineering, or related field.
Industry Experience: Minimum 5-10 years of experience in the semiconductor advanced packaging capital equipment or Semiconductor Advanced Packaging manufacturing.
Strong understanding of advanced semiconductor packaging technologies.
Proven track record in a similar role involving both technical application support. Role in New Product Introduction is a plus
Experience with wafer temporary bonding and debonding processes is a plus
Analytical Skills: Strong analytical skills, with the ability to interpret complex data and reports.
Excellent communication skills, both written and verbal.
Languages: Traditional Mandarin as mother tongue, fluent in English.