Skip to content
Wafer Probing
Our Thermal Chucks
AirCool®
AC3
AirCool® PRIME
Our Solutions
High Thermal Uniformity / Accuracy
High Power Dissipation
Anti-Magnetic
High Voltage / Current
Ultra Low Noise
Special Vacuum Design
Integration & Sealing
ProbeSense™
Advanced Packaging
PhotoThermal Debonding
Automatic Luminex – LUM300A
Semi-Automatic Luminex – LUM600S1
Thermal Debonding
Automatic Debond Machine
Automatic Panel Debond Machine
Manual Debond Machine
Manual Panel Debond Machine
Warpage Adjustment
Automatic Warpage Adjust Tool
Manual Warpage Adjust Tool
3D Wafer Profiler – Wave 3000
About
Our Team
Innovation, History and Quality
Sustainability
News & Events
Career
Contact Us
Sales Wafer Probing
Sales Advanced Packaging
Support
Apply
English
Deutsch
简体中文
日本語
Click to view the navigation
patent illustration6
Back to top
Click to close the navigation
English
Deutsch
简体中文
日本語
Wafer Probing
Our Thermal Chucks
AirCool®
AC3
AirCool® PRIME
Our Solutions
High Thermal Uniformity / Accuracy
High Power Dissipation
Anti-Magnetic
High Voltage / Current
Ultra Low Noise
Special Vacuum Design
Integration & Sealing
ProbeSense™
Advanced Packaging
PhotoThermal Debonding
Automatic Luminex – LUM300A
Semi-Automatic Luminex – LUM600S1
Thermal Debonding
Automatic Debond Machine
Automatic Panel Debond Machine
Manual Debond Machine
Manual Panel Debond Machine
Warpage Adjustment
Automatic Warpage Adjust Tool
Manual Warpage Adjust Tool
3D Wafer Profiler – Wave 3000
About
Our Team
Innovation, History and Quality
Sustainability
News & Events
Career
Contact Us
Sales Wafer Probing
Sales Advanced Packaging
Support
Apply
