ERS is attending several events all over the world throughout the year. If you want to set up a meeting with us during one of the events, please message us on meetus@ers-gmbh.de.
Event Calendar 2022:
Semicon Korea
February 9th – 11th, Korea World Trade Tower, Seoul, Korea
Co-exhibiting with Korean channel partner Woowon Technology Co. Ltd. in Booth A410
Wafer Level Packaging Symposium
February 15th – 17th, DoubleTree by Hilton San Jose, San Jose CA, US
Exhibiting in Booth 13
Device Packaging Conference by IMAPS
March 7th – 10th, WeKoPa Resort and Conference Center, Fountain Hills AZ, US
Presentation: “FOWLP Thermal Debonding: Easing Manufacturing Constraints” by FO Equipment Business Unit Manager, Debbie-Claire Sanchez
CSPT
March 15th – 16th, Jiangyin, China
Keynote presentation: “Thermal Debonding: a fundamental to Fan-out” by Joshua Zhou, Vice President and Sales and Marketing Director of ERS China
SW Test
June 5th – 8th, Omni La Costa, Carlsbad CA, US