HIGH THERMAL
UNIFORMITY /
ACCURACY
DESCRIPTION
The need for sensors in the automotive industry, and for environmental and Internet of Things (IoT) applications is growing. When testing these devices at wafer-level, it is crucial that they are exposed to a uniform chuck surface with an accurate temperature readout.
ERS’s AC3 High Thermal Uniformity (HTU) chuck system is a breakthrough device that has introduced High Thermal Uniformity and Accuracy in wafer testing. It is the ideal tool for probing of the new generation of temperature-sensitive sensors and high precision analog devices.
For calibration of values such as gas concentration, humidity, and pressure, it is crucial to know the exact temperature of the device under test (DUT). Therefore, ERS has developed a High Temperature Accuracy technology, which can achieve an accuracy down to 50mK.
The innovative HTU and HTA AirCool® chuck systems are available now in both 200mm and 300mm wafer formats. Both feature a thermal uniformity lower than ±0,1°C, and a temperature control stability better than ±0,03°C.
The HTU chuck systems come with ITS90 calibration and are traceable to the ISO 17025 standard.
OUR OPTIONS
AC3
±0,5°C Uniformity
±100mK Accuracy
HTU
< ±0,1°C
Excellent Uniformity
HTA
< 50mK
High Temperature Accuracy
HTU2
HTU1 Uniformity +
HTA Accuracy
TECHNICAL DATA
0°C to 30°C: ≤ ±0.2°C
30°C to 60°C: ≤ ±0.1°C
60°C to 90°C: ≤ ±0.2°C
90°C to 200°C: ≤ ±0.5%
-20°C to 0°C ≤±0.2°C
0° to +90°C ≤±0.1°C
+90°C to +120°C ≤±0.2°C
+120°C to +200°C ≤±0.5°C
≥ 200°C ≤±0.5°C
- 40 °C to +25°C: 10 min
+25 °C to +150 °C: 20 min
+25 °C to +200 °C: 25 min
+25 °C to +300 °C: 40 min
+200 °C to +25 °C: 35 min
+300 °C to +25 °C: 40 min
+25 °C to 0 °C: 15 min
+25 °C to -40 °C: 35 min
+25 °C to -55 °C: 40 min
For special requirements, please contact us.